Radio frequency identification tag

ABSTRACT

The invention is a radiofrequency identification tag comprising a semiconductor chip having radio frequency, logic, and memory circuits, and an antenna that are mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination are sealed with an organic film covering.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.08/303,976, filed Sep. 9, 1994, and issued as U.S. Pat. No. 5,682,143.

FIELD OF THE INVENTION

This invention relates to the field of radio frequency (RF) tagging.More specifically, the invention relates to an improved small size, lowcost RF tag that transmits multiple bits of information.

BACKGROUND OF THE INVENTION

In general, circuitry is manufactured on hard printed circuit boards orflexible substrates. Printed circuit boards include materials likeepoxy-resin or epoxy-glass boards. One generic class on which thesecircuits are manufactured is FR4. Alternatively flexible substrates,also called "flex", include structures of copper on polyimide. Thesecircuits are generally used in automobiles, consumer electronics, andgeneral interconnections.

A well known technology for attaching semiconductor circuits, or"chips", to the circuit board or flex structures is called wirebonding.Wire bonds are made from small diameter wires in the range of 25 micronsin diameter and are very short. Generally the wire bonds are on theorder of 1 millimeter (mm) in length. These wire bonds are normally keptshort for several reasons:

1. The small diameter of the wire makes it very weak.

2. In typical circuits many bonds are made and longer lengths would makethe connections more prone to electrical shorting.

3. Longer lengths of the wires increase self and mutual inductance whichdegrade the electrical performance of the circuit.

Radio Frequency Identification (RF ID) is just one of manyidentification technologies for identifying objects. The heart of the RFID system lies in an information carrying tag. The tag functions inresponse to a coded RF signal received from a base station. The tagreflects the incident RF carrier back to the base station. Informationis transferred as the reflected signal is modulated by the tag accordingto its programmed information protocol.

The tag consists of a semiconductor chip having RF circuits, logic, andmemory. The tag also has an antenna, often a collection of discretecomponents, capacitors and diodes, for example, a battery in the case ofactive tags, a substrate for mounting the components, interconnectionsbetween components, and a means of physical enclosure. One variety oftag, passive tags, has no battery. They derive their energy from the RFsignal used to interrogate the tag. In general, RF ID tags aremanufactured by mounting the individual elements to a circuit card. Thisis done by using either short wire bond connections or solderedconnections between the board and the circuit elements: chip,capacitors, diodes, antenna. The circuit card may be of epoxy-fiberglasscomposition or ceramic. The antennas are generally loops of wiresoldered to the circuit card or consist of metal etched or plated on acircuit card. The whole assembly may be enclosed in a plastic box ormolded into a three dimensional plastic package.

While the application of RF ID technology is not as widespread as otherID technologies, barcode for example, RF ID is on its way to becoming apervasive technology in some areas, notably vehicle identification.

Growth in RF ID has been inhibited by the absence of infrastructure formanufacturing tags, the high cost of tags, the bulkiness of most of thetags, problems of tag sensitivity and range, and the need for thesimultaneous reading of multiple numbers of tags. A typical tag costs inthe $5 to $10 range. Companies have focused on niche applications. Someprior art is used to identify railway boxcars. RF tags are now used inthe automatic toll industry, e.g. on thruway and bridge tolls. RF tagsare being tested for uses as contactless fare cards for buses. Employeeidentification badges and security badges have been produced. Animalidentification tags are also commercially available as are RF ID systemsfor tracking components in manufacturing processes.

One limitation of making RF tags made from PC boards or flex is that theflex or boards must be manufactured first. For very high volumes of tags(greater than one hundred million tags) new factories must be built toaccommodate the capacity needed for board or flex production to meet tagdemand. Further, RF tags made from these technologies are too expensivefor many applications. For example, bar codes are a technology that isused for identification at a much lower cost than existing RF taggingtechnology.

SUMMARY OF THE INVENTION

The present invention is a novel radio frequency (RF) tag that comprisesa semiconductor circuit that has logic, memory, and radio frequencycircuits. The semiconductor is mounted on a substrate and is capable ofreceiving an RF signal through an antenna that is electrically connectedto the semiconductor through connections on the semiconductor.

The antenna is novel, has a novel structure, and is constructed by anovel use of wire bonding techniques. The antenna is one or more wires,each connected to the semiconductor connections by one or two wirebonds. In a preferred embodiment, the antenna is made of a pair orplurality of pairs of wires. The wire bonding method and resultingstructure, rather than having another connection made at the end of ashort wire, spools out a length of wire required by the antenna design,and cuts the second end of the wire without making any electricalconnection at the second cut end. In some preferred embodiments, thesecond cut end of the wire is held in place by attaching the cut end tothe substrate with adhesive or by local heating of the substrate. Inthis way, the wire bonding method is used to actually create a componentof the RF tag circuit (the antenna) not to connect two components. Theresulting novel antenna structure is a long wire connected to thecircuit by a wire bond. The components of the novel RF tag are thencovered in an organic cover that has a novel use in this type of device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric drawing of the present invention showing oneembodiment of a radio frequency tag with a single antenna.

FIG. 2 is an isometric drawing of the present invention showing oneembodiment of a radio frequency tag with multiple antennas.

FIG. 3 is an isometric drawing of the present invention showing oneembodiment of a radio frequency tag with multiple antennas oriented in adifferent direction with respect to each other.

FIG. 4 is an isometric drawing of one embodiment of the presentinvention showing a radio frequency tag with a single loop antenna.

FIG. 5 is an isometric drawing of one embodiment of the presentinvention showing a radio frequency tag with multiple loop antennas.

FIG. 6 is an isometric drawing of the present invention showing a radiofrequency tag with a single loop antenna, where cutout tabs secure theends of the antenna.

FIG. 7 is a top view drawing of the present invention showing a radiofrequency tag with a single loop antenna, where cut out tabs securelocations on the antenna so that the antenna has an orientation in twodimensions.

FIG. 8 is a top view drawing of the present invention showing oneembodiment of a radio frequency tag with multiple antennas.

FIG. 9 is a top view drawing of the present invention showing oneembodiment of the present invention showing two tags with loop antennason one substrate.

FIG. 10 is an isometric drawing of the present invention showing a radiofrequency tag with a single loop antenna, where studs secure the ends ofthe antenna.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a drawing of a novel radio frequency tag 100 that comprises asubstrate 141, a semiconductor circuit 111, a first connection 121, asecond connection 122, a first wire 131 bound to the first connection121 by a bond 131A, and a second wire 132 bound to the second connection122 by a bond 132A. These components are covered by an organic cover 151that serves as environmental protection for the antenna 133 comprisingwires (131, 132) and bonds (131A, 132A), and circuit 111.

The substrate 141 is made from an organic film. A preferred film ispolyester also known as mylar (Mylar is a trademark of Dupont). Anotherpreferred film is polyimide also known as Kapton (Kapton is a trademarkof Dupont). Such materials are used as substrates 141 and are well knownin the art.

The semiconductor circuit 111 has a memory, logic circuits, and radiofrequency (RF) circuits and in a preferred embodiment has no battery.Circuits like this used for RF tags are well known and commerciallyavailable. The semiconductor circuit can be attached to the substrate bymeans of adhesive or reflowing the substrate 141 by local heating. Thesemiconductor also has one or more of connections (121 and 122). Theconnections (121 and 122) provide an input and output (I/O) connectionto the RF circuitry of the semiconductor. The connections 121 and 122have an impedance that can be varied by logic in the semiconductor 111.When an RF signal sent to the RF tag is sensed by a circuit in thesemiconductor 111, a logic circuit in the semiconductor 111 causes theimpedance between the contacts to change according to some preprogrammedlogic. This impedance change modulates the RF signal reflected from theRF tag. This modulation allows the RF tag to send information back to abase station which originally sent the RF signal.

An antenna connected to the semiconductor 111 plays an essential part inthe reception of the RF signal and transmission (reflecting back) of themodulated RF signal. The present invention is a novel antenna andsemiconductor structure.

One preferred antenna and semiconductor structure is shown as wires 131and 132 connected to connections 121 and 122 respectively. In thisembodiment the wires are connected by wire bonding at bond locations131A and 132A, respectively. While connecting wires with wire bonding iswell known, wire bonding techniques are not used to create componentstructures of a circuit as in the present invention. In this invention,the wire bonding creates a novel antenna and connection structure thatmatches the transmission (signal reflection) and reception requirementsof the semiconductor circuit 111.

In this embodiment, each wire is connected by wire bonding techniques atone bond connection (131A and 132A, respectively), unspooled to aspecified length, and then cut, where the cut end of each wire is leftunconnected. The cut can be performed by any well known method includingknife blade (swedge, guillotine), mechanical chopper, mechanicalpincers, laser, etc. Furthermore, the wires 131 and 132 can be connectedat the bond points (131A and 132A) by means other than wire bondingincluding: laser, soldering, and conducting epoxy.

The cut end of the wire can be held in place in several ways. The cutend of the wire can be held in place on the substrate by a small spot ofadhesive 169 placed below the cut end. The cut end could also be held inplace by locally heating the substrates at the point where the cut endrests so that the substrate becomes sticky and adheres to the cut end.Localized heating of substrates is well known and includes spotapplication of heat with tools or a laser beam focused at the point ofheating. Adhesives are also well known. They include epoxies, silicones,and phenolic-butaryl.

A further way of attaching the cut end to the substrate involves heatingthe wire (131, 132) so that the cut end heats up the substrate at thepoint of contact and causes the cut end to attach to the substrate. Thewire can be heated by inductive heating, resistive heating, laserheating, or any other method used for this purpose. Alternatively, aportion of the substrate under the wire can be heated so that part orall of the wire becomes embedded in the substrate. This effect can alsobe accomplished by heating the wire and applying pressure to part (orall) of the wire so that part (or all) of the wire (131, 132) becomesembedded in the substrate.

Using this novel structure, RF tag antenna components can bemanufactured by only using commodity materials, i.e., wire used for wirebonds and unpatterned organic plastic (like polyester) for thesubstrate. No circuit boards or patterned flexible substrate material isrequired. Since only commodity materials (wire and organic plastic) areneeded to produce these novel tag structures, large quantities (greaterthan 100 million) of tags can be manufactured inexpensively withoutbeing limited by the existing manufacturing infrastructure.

The length of the wire (131, 132) is determined by the frequency of theRF signal at which the RF tag is to be operated. These frequencies canbe any frequency that can be transmitted. However, in a more preferredembodiment, the frequencies lie in a range above 300 Megahertz. In thisrange of frequencies, antenna of reasonable length can be constructed tobe resonant. An even more preferred range of frequencies is between 900Megahertz to 20 Gigahertz. The most preferred frequencies are thosepermitted for RF tag use by the Federal Communications Commission, someof which include 0.915, 1.92, 2.45, and 5.0 Gigahertz.

To produce a preferred resonant antenna, the lengths (162, 163) of thetwo wires (131, 132) comprising the antenna are equal. In a preferredembodiment, each of the lengths, (162, 163) is one quarter wavelengthlong. More specifically, the length of each wire is equal to (c/4)×f,where c is the speed of light and f is the radio frequency 105 that theRF tag is operating at. In practice, the length will be slightly less(by a factor of approximately 5%) to account for capacitance effects.Similarly, the sum of the lengths of 162 plus 163 is one halfwavelength, where the total length to be used in practice is0.95×(c/2)×f. Hereafter, when a specific length is referred to, it willbe the total of the wavelengths (162 plus 163) or a half-wavelengthlength. A preferred range of total antenna wire (131, 132) lengths (162,163) is between 10 millimeters and 1000 millimeters in length. A morepreferred range of antenna wire lengths is between 28 mm and 150millimeters. Specific preferred lengths (162, 163) of the antenna wires(131, 132) are 150 mm, 74 mm, 58 mm, 28 mm lengths that match therespective frequencies above.

The wire used to construct the antennas is that which is commonly usedfor short wire bond connections. The wire diameter 170 may be between 25micron inch and 250 microns. The wire may be composed of aluminum alloy,copper alloy, gold alloy, copper, gold-plated copper and gold. Such wireis commercially available from many sources, e.g., the American FineWire Company of Selma, Ala. Aluminum-alloy wire is preferred because ofits low cost. Alternate materials may be chosen based on cost,availability, and bondability to the chip contact pads. Use of this typeof wire with this diameter in the manufacture of RF tag antennas isthought to be novel.

Adhesive 161 in FIG. 1 secures substrate 141 to cover layer 151. Theadhesive serves to hold the chip and wires in place and to seal thepackage. By using adhesive over the entire substrate, not just the edgesof the package, voids which may accumulate moisture are not allowed toform. Since moisture will accelerate corrosion, the exclusion ofmoisture will improve the reliability of the package. Adhesives commonlyused in the semiconductor industry include epoxies, silicones, andphenolic-butyral. A unique aspect of this package is to use alow-melting point polymer as a preferred adhesive, EVA or ethyl vinylacetate. EVA is well known in the bookbinding and food industries butits use in the semiconductor industry in RF tag structures is thought tobe novel. In various preferred embodiments, the adhesive 161 can beplaced locally on the substrate around the components (antenna,semiconductor), or placed on the cover 151 before the cover is placed onthe substrate 141.

The antenna (131, 132), the semiconductor 111, and the substrate 141 areencapsulated by an organic cover 151 using a novel technique for the RFtag art. These components are placed in a laminating machine thatapplies an organic material (ethyl vinyl acetate) heated enough tobecome soft and sticky as it is applied with pressure to the structure.In this way, voids in the non-planar surface are filled with the organicmaterial. In a more preferred embodiment, the organic material comprisestwo layers, one of organic material 151 and another of organic adhesive161. In this case the heat and pressure are also applied. The heatcauses the adhesive to flow to fill the voids on the non-planar surfaceof the structure. An alternative preferred embodiment uses a pressuresensitive adhesive without the heating.

FIG. 2 is a drawing of a novel radio frequency tag 200 that comprises asubstrate 141, a semiconductor circuit 211, a first connection 221, asecond connection 222, third connection 223, a fourth connection 224, afirst wire 231 bound to the first connection 221 by a bond 231 A, and asecond wire 232 bound to the second connection 222 by a bond 232A, and athird wire 233 bound to the third connection 223 by a bond 233A, and afourth wire 234 bound to the fourth connection 224 by a bond 234A. Thesecomponents are covered by an organic cover 151 that serves asenvironmental protection for the wires (231-234) and bonds (231A-234A)and circuit 211. These bonds (231A-234A) are wire bonds as describedabove or their equivalents.

This diagram incorporates more than two wires (231-234) to form multiplesets of antennas (231-232 and 233-234), e.g., antenna 241 compriseswires 231 and 232 and antenna 242 comprises wires 233 and 234. Themultiple antennas increase the strength of the signal received by thechip 211 and provide a measure of redundancy. The antennas may be ofdifferent lengths in order to be resonant at different frequencies.

FIG. 3 is a drawing of a novel radio frequency tag 300 that comprises asubstrate 141, a semiconductor circuit 311, a first connection 321, asecond connection 322, third connection 323, a fourth connection 324, afirst wire 331 bound 321A to the first connection 221, and a second wire332 bound 322A to the second connection 322, and a third wire 333 bound323A to the third connection 323, and a fourth wire 334 bound 324A tothe fourth connection 324. These components are covered by an organiccover 151 that serves as environmental protection for the wires(331-334) and bonds (321A-324A) and circuit 311. In the preferredembodiment, the bonds are wire bonds (321A-324A) or their equivalents asdescribed above.

In FIG. 3, the pairs of wires (331, 333 and 332, 334) are arranged in adifferent, non parallel direction from each other, preferablyperpendicular so as to maximize the reception and transmission of radiofrequency energy in directions perpendicular to each other. Thiseliminates nulls in the reception/transmission pattern.

FIG. 4 is a drawing of a novel radio frequency tag 400 that comprises asubstrate 141, a semiconductor circuit 411, a first connection 421, asecond connection 422, a wire 431 bound to the first connection 421 by abond 421A at one end of the wire, and the same wire 431 bound to thesecond connection 422 by a bond 422A at the other end of the wire 431.These components are covered by an organic cover 151 that serves asenvironmental protection for the wire 431, bonds (421A, 422A), andcircuit 411. In the preferred embodiment, the bonds (421A, 422A) arewire bonds or their equivalent as described above. In another preferredembodiment, a polymeric encapsulant 405 provides an encapsulation forthe chip, is used to insulate adjacent conductors from each other,improves vibration and shock resistance, provides mechanical rigidity tothe device and connections, and provides protection from atmosphericattack and dust. Preferably this polymeric encapsulant is opaque toprotect light sensitive circuit and forms a thin layer of protection 100microns (4 mils).

In this diagram, the wire 431 is arranged to form a single loop antenna433. This antenna will have a higher impedance than that of the antenna133 (comprising wires 131 and 132 as shown in FIG. 1). It may thustransfer more energy to a high-impedance input circuit on chip 411. Theloop is created by moving the wire 431 with the wire bonding tool. In apreferred embodiment, the wire is held in place on the substrate by anadhesive on the substrate to help in the formation of the loop.

FIG. 5 is a drawing of a novel radio frequency tag 500 that comprises asubstrate 141, a semiconductor circuit 511, a first connection 521, asecond connection 522, a wire 531 bound to the first connection 521 by abond 531A at one end of the wire, and the same wire 531 bound to thesecond connection 522 by a bond 532A at the other end of the wire. Asecond loop antenna is formed with a third connection 523, a fourthconnection 524, a wire 536 bound to the third connection 523 by a bond533A at one end of the wire 536, and the same wire 536 bound to thefourth connection 524 by a bond 534A at the other end of the wire 536.These components are covered by an organic cover 151 that serves asenvironmental protection for the wires (531, 536) the bonds (531A-534A),and circuit 511. The bonds are wire bonds as described above or theirequivalents.

The addition of a second loop antenna increases the sensitivity of thetag by increasing the total strength of the signal received.

FIG. 6 is a drawing of a novel radio frequency tag 600 that comprises asubstrate 141, a semiconductor circuit 611, a first connection 621, asecond connection 622, a wire 631 bound 631A to the first connection 621at one end of the wire 631 and the same wire 631 bound 632A to thesecond connection 622 at the other end of the wire. These components arecovered by an organic cover 151 that serves as environmental protectionfor the wire 631, the bonds (631 A and 632A), and circuit 611. Thesubstrate 141 is provided with punched notches 681 and 682 which providemeans for retaining the wire at its ends to hold the wire in placeduring manufacture. A punched notch 681 is cut in the substrate so thatit produces a bendable flap 685 which can hold the wire as it is looped.This cut can be produced by a punch tool. An air jet 687 would displacethe flap, i.e., bend it from the substrate until the wire could belooped between the bent flap 685 and the remaining substrate.

FIG. 7 is a top view drawing of a novel radio frequency tag 700 thatcomprises a substrate 141, a semiconductor circuit 711, a firstconnection 721, a second connection 722, a wire 731 bound to the firstconnection 721 and the same wire 731 bound to the second connection 722.These components are covered by an organic cover 151 that serves asenvironmental protection for the wire 731, the bonds, and circuit 711.The substrate 141 is provided with punched flaps 781, 782, 783, and 784which allow wire 731 to be held in place during manufacture.

Note that the preferred embodiment of the radio frequency tags in thisdisclosure are passive, i.e., there is no battery on the substrate 141.However, an alternative embodiment is an active tag, as shown in FIG. 7,where a battery 791 is connected to the semiconductor 711 at connections723, 724 in order to provide on board power to the semiconductor 711.

FIG. 8 is a top view drawing of a novel radio frequency tag 800 thatcomprises substrate 141, a semiconductor chip 811, with contacts 810,and 815. Wires 821, 823, and 824 are bonded to contact 810. Wires 825,826, and 827 are bonded to contact 815. These components are covered byan organic cover 151 that serves as environmental protection for thewires 821, 823, 824, 825, 826, and 827, the bonds and circuit 811.

FIG. 9 is a top view drawing of a novel radio frequency tag 900 thatcomprises substrate 141, two semiconductor chips 910 (and 911), withcontacts 915 and 916 (917 and 918). Wires 970 (and 980), are bonded tocontacts 915 and 916 (917 and 918). Wire 970 is connected from contact915 around punched flaps 930 and 940 to contact 916 in substrate 141.Wire 980 is connected from contact 917 around punched flaps 960 and 950to contact 918 in substrate 141. These components are covered by anorganic cover 951 that serves as environmental protection for wires 970and 980, the bonds, and circuits 910 and 911.

FIG. 10 is a drawing of a novel radio frequency tag 1000 that comprisessubstrate 141, semiconductor chip 1011 with contacts 1021 and 1022. Wire1031 is bonded to contact 1021 by bond 1021A and wrapped around embossedpillar 1091 and 1092 and then bonded to contact 1022 by bond 1022A.These components are covered by an organic cover 1051 that serves asenvironmental protection for wire 1031, the bonds and circuit 1011. Thesubstrate is provided with raised studs or dimples which provide meansfor retaining the wire at its ends to hold the wire in place duringmanufacture while the wire 1031 is looped. The studs can be made using aheated die or punch to make part of the substrate deform to the diecontour so that the stud or dimple (1091, 1092) protrudes above thesurface of the substrate. This technique and equivalents are common inthe art, e.g., the embossing techniques used to create raised letters ona plastic credit card. The studs may also be created by adding apreformed piece to the substrate. One preferred added piece would be amolded plastic.

In a more preferred embodiment, pillars 1091 and 1092 are made with atool that deforms the substrate 141 at an acute angle with the substrateso that the angle opens away from the chip 1011. In this way, the wire1031 will not slip off of the pillars 1091 and 1092 before the cover1051 is applied. In an alternative preferred embodiment, the pillars1091 and 1092 are made so that the tops are larger in diameter than thebottoms (the portion closes to the top surface of the substrate). Thiscan be done applying pressure on the tops of the pillars to flare thetop.

It is evident that one skilled in the art given this disclosure coulddevelop equivalent embodiments which are also within the contemplationof the inventors.

We claim:
 1. A radio frequency tag apparatus comprising:a semiconductorcomprising logic and a first and a second connection coupled to thelogic; a first wire having a bound end connected to the first connectionby a wire bond connection, and the first wire having an unconnected end;a second wire having a bound end connected to the second connection by awire bond connection, and the second wire having an unconnected end; andthe first and second wire interacting with the logic of thesemiconductor as an antenna.
 2. The radio frequency tag apparatus ofclaim 1, the first wire and the second wire being of approximately equallength.
 3. The radio frequency tag apparatus of claim 2, the lengths ofthe first and second wires being selected such that the antenna isresonant at a predetermined frequency.
 4. The radio frequency tagapparatus of claim 1, further comprising:the semiconductor furthercomprising a third and a fourth connection coupled to the logic; a thirdwire having a bound end connected to the third connection by a wire bondconnection, and the third wire having an unconnected end; a fourth wirehaving a bound end connected to the fourth connection by a wire bondconnection, and the fourth wire having an unconnected end; and the thirdand fourth wire interacting with the logic of the semiconductor as anantenna.
 5. The radio frequency tag apparatus of claim 1, furthercomprising:a third wire having a bound end connected to the firstconnection by a wire bond connection, and the third wire having anunconnected end; a fourth wire having a bound end connected to thesecond connection by a wire bond connection, and the fourth wire havingan unconnected end; and the third and fourth wire interacting with thelogic of the semiconductor as an antenna.
 6. The radio frequency tagapparatus of claim 5, wherein the third wire is of a different lengththan the first wire, and wherein the fourth wire is of a differentlength than the second wire.
 7. The radio frequency tag apparatus ofclaim 1, further comprising an encapsulant material, the encapsulantmaterial encapsulating at least part of the semiconductor, the firstwire, and the second wire.
 8. The radio frequency tag apparatus of claim1, wherein the logic is configured for use in an automated toll system.9. The radio frequency tag apparatus of claim 1, wherein the logic isconfigured for use in vehicle identification.
 10. The radio frequencytag apparatus of claim 1, further comprising a substrate, thesemiconductor disposed on the substrate.
 11. The radio frequency tagapparatus of claim 10, the unconnected ends of the first and secondwires coupled to the substrate via an adhesive.
 12. The radio frequencytag apparatus of claim 10, the unconnected ends of the first and secondwires coupled to the substrate via local heating of the substrate. 13.The radio frequency tag apparatus of claim 10, the unconnected ends ofthe first and second wires coupled to the substrate via heating of thefirst and second wires.
 14. The radio frequency tag apparatus of claim10, wherein the semiconductor is fixed to the substrate via an adhesive.15. The radio frequency tag apparatus of claim 1, further comprising abattery coupled to the logic.
 16. A radio frequency tag apparatuscomprising:a semiconductor comprising logic and second, third and fourthconnections coupled to the logic; a first wire having a first endconnected to the first connection and a second end connected to thesecond connection; a second wire having a first end connected to thethird connection and a second end connected to the fourth connection;and the first wire and the second wire interacting with the logic of thesemiconductor as antennas.
 17. The radio frequency tag apparatus ofclaim 16, further comprising:a substrate, the semiconductor disposed onthe substrate; and at least one of the first and second wires fixed tothe substrate by a punched notch in the substrate.
 18. The radiofrequency tag apparatus of claim 16, further comprising:a substrate, thesemiconductor disposed on the substrate; and at least one of the firstand second wires fixed to the substrate by pillars formed on thesubstrate.